Model Number

RW-AEX

PCB dimension: W50×D50~W400×D300mm
PCB thickness: 0.5~4mm
Working table adjustment: ±50mm forward/backward, ±200mm left/right
Temperature control: K-type thermocouple, close cycle controlled
PCB locating way: Outer or Jig
Bottom heater: infrared, 2500W
Nozzle heater: hot air, 800W
Power supply: single-phase 220V, 50/60Hz, 3.5KW
Machine dimension: L800×W700×H450mm
Weight: Appox. 40kgs

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* Made of quality heating material; desolding and soldering procedures of BGA are precisely 

  controlled;

* Air flow and temperature are adjustable in a wide range to form high temperature breeze;

* Movable heating head, easy to operate;

* Two independent heating areas, temperature and time are digital displayed;

* Large IR bottom heater will heat the PCB evenly to avoid deformation and keep the solder

  effect;

* Powerful cross flow fans cool the lower heating area rapidly;

* With different Tin alloy hot air nozzles, easy to replace;

* PCB rack is adjustable for protecting your hands from hot;

* The supports for the BGA soldering supporting frame are micro-adjustable to restrain local 

  sinkage in the soldering area;

* 8 segments of temperature up (down) and 8 segments constant temperature control, 10

  groups of temperature curve are stored. With computer communication function, 

  communication software is attached, two curves can be displayed in the same time, and

  buzz will be given after soldering is finished or removed;

* Buzz after soldering is finished or desoldering;

* Hand vacuum pen is adjustable for removing BGA;

* Over-heating alarm and protection for the upper hot air heating header.